March 14, 2016
December 24, 2015
December 24, 2015
Background
In recent years, there has been an increasing number of devices that generate high heat values, which include automotive products and other high-power-consumption devices, high-brightness LEDs, and high-performance CPUs.
Generally, an increase in a semiconductor device's junction temperature Tj will result in a shorter life and higher failure rate. Therefore, thermal design considering the radiation performance will be required in the design phase of the device or system.
To meet those needs, Espec added a thermal analysis capability to the power cycle test system for reliable evaluation of power semiconductor devices.
Thermal analysis capability
Thermal Resistance is a parameter of the thermal analysis function.
Measurement of thermal resistance, an important parameter for thermal design for improved heat dissipation, will serve as one index in thermal design.
By converting the measurement result of transient thermal resistance into structure function, heat conductivity of each structure part within the specimen can be represented by inclination. Measure the transient thermal resistance for any given cycle to check the time degradation of each structure part within the specimen.
Feature 1
For measurement of transient thermal resistance, the system features both heating method (dynamic method) and cooling method (static method). The user is allowed to select a mode to suit the purpose; for example, evaluation of stationary thermal resistance, or transient thermal resistance of short-term phenomena.
Feature 2
The thermal analysis function can be integrated into the power cycle test, which enables continuous evaluation without mounting or dismounting a sample from the unit.
September 1, 2015
ESPEC introduces Platinous J series with the new network controller which allows monitoring and programming the chamber via any PC, mobile devices such as tablets and smartphones on your network.
September 1, 2015
Remote chamber management on your network expands environmental test potential. ESPEC introduces ESPEC Online series that allows monitoring, control, programming, data logging, test scheduling and alarm & scheduled maintenance notifications by email.
Up to 100 chambers and other devices such as network camera and measurement system can be managed at the same time. Other brand's chambers can be connected, too.
Features: Remote management such as test scheduling and monitoring via web browser on your PC on the intranet
Add network functions to your existing chamber which does not support network connection.
Support many chamber types via RS-485 (since Platinous K series, Benchtop type SH/SU-XX1, Thermal shock TSA-XX1, etc.)
Features: Remote monitoring, control, programming, data logging and alarm & scheduled maintenance notifications by email
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